Failure Analysis Testing 失效分析测试
When a product or device fails, you need to know why. Root cause failure analysis helps a business get to the source of a product failure. More importantly, it provides the manufacturer with the information needed to address and correct the issue causing the failure.
当产品或设备出现故障时，您需要知道原因。根本原因故障分析可帮助企业找到产品故障的根源。更重要的是，它为制造商提供了解决和纠正导致故障的问题所需的信息。
Root cause failure analysis is usually a multidisciplinary process. The tools NTS uses during an analysis include visual inspections, metallographic, environmental and chemical analysis and simulation tests. The specific tests utilized depend on the type of product and the failure mode. Root cause failure examinations are designed to determine the cause of the failure and the corrective actions needed to prevent it. However, product failure can be a complicated process. In our experience, device failure is rarely due to a single event.
故障根本原因分析通常是一个多学科的过程。 NTS 在分析过程中使用的工具包括目视检查、金相、环境和化学分析以及模拟测试。使用的具体测试取决于产品的类型和故障模式。根本原因故障检查旨在确定故障原因以及预防故障所需的纠正措施。然而，产品故障可能是一个复杂的过程。根据我们的经验，设备故障很少是由单一事件造成的。
The physical signs of failure, such as a cracked metal component or a malfunctioning electronic device, are the most obvious. However these signs are often little more than symptoms of failure. NTS looks for the root cause of the failure.
故障的物理迹象，例如金属部件破裂或电子设备故障，是最明显的。然而，这些迹象通常只不过是失败的症状。 NTS 寻找失败的根本原因。
Potential causes of a device failure may include:
设备故障的潜在原因可能包括：
- Product design 产品设计
- Manufacturing processes 制造流程
- Contamination of the source materials
原材料污染 - Product packaging 产品包装
- Product storage 产品储存
- Improper Handling 处理不当
Determining the root cause of a failure is a three-part process.
确定故障的根本原因是一个由三部分组成的过程。
Step 1: Data Collection
第 1 步：数据收集
The first step in a root cause failure analysis is data collection. During this step, NTS will collect information about how the device failed and when it occurred. We will also work with you to determine your goals for the failure analysis examination, determine how the part should operate, and consult with additional subject matter experts, if needed.
故障根本原因分析的第一步是数据收集。在此步骤中，NTS 将收集有关设备如何发生故障以及何时发生故障的信息。我们还将与您一起确定故障分析检查的目标，确定零件的运行方式，并在需要时咨询其他主题专家。
The type and breadth of questions we ask during this step can be surprising to an organization that has not performed failure analysis previously. Some of the information important to collect during this phase includes:
对于以前没有进行过故障分析的组织来说，我们在此步骤中提出的问题的类型和广度可能会令人惊讶。在此阶段需要收集的一些重要信息包括：
- What are the steps of the manufacturing process?
制造过程有哪些步骤？ - What is involved in each process step?
每个流程步骤涉及什么？ - What are all of the components in the device?
设备中的所有组件是什么？ - What are the specific component’s purposes?
具体组件的用途是什么？ - What are the ways in which each of these components could fail?
这些组件可能会以哪些方式发生故障？ - How severe is the impact of these potential failures?
这些潜在故障的影响有多严重？ - What types of device failures are actually occurring?
实际发生了哪些类型的设备故障？ - At what point does a failure affect the device’s function?
故障在什么时候会影响设备的功能？ - What is the likelihood device failures are noticed before they reach the consumer?
设备故障在到达消费者手中之前被注意到的可能性有多大？ - What is the history of the failed unit?
失败单位的历史是什么？ - What is the occurrence of failures?
故障的发生是怎样的情况？
During this phase, we will conduct tests on the product being analyzed. It is common to test a representative sample of failed devices as well as those that are working properly. This can help to determine what components are failing and when the failure occurs.
在此阶段，我们将对正在分析的产品进行测试。测试故障设备和正常工作设备的代表性样本是很常见的。这可以帮助确定哪些组件出现故障以及故障发生的时间。
Whenever possible, we prefer non-destructive tests in the failure analysis testing. This tends to provide the most accurate data and is more economically efficient for the customer. Sometimes the failure analysis requires cross-sections of the material or perform thermal testing. In these cases, we perform these tests later in the data collection process.
只要有可能，我们在失效分析测试中更喜欢无损测试。这往往会提供最准确的数据，并且对客户来说更具经济效率。有时，失效分析需要材料的横截面或进行热测试。在这些情况下，我们稍后在数据收集过程中执行这些测试。
Step 2: Analyze Data Collected to Determine Root Cause Failure
第 2 步：分析收集的数据以确定故障根本原因
The next step in the failure analysis process is to determine the root cause of the failure. Device failure is rarely the result of a single incident. Our experience has shown there are multiple inputs into even a “simple” failure. This indicates there are often different ways to prevent the failure in the future.
故障分析过程的下一步是确定故障的根本原因。设备故障很少是由单一事件造成的。我们的经验表明，即使是“简单”的失败，也会有多种因素的影响。这表明通常有不同的方法可以防止将来发生故障。
Consider this example of an electronic device failure. An organization has received customer complaints of a device short circuiting periodically and contracts with NTS to conduct a root cause failure analysis. Electronic failure analysis tests show the component short circuits because depending on where the metal in the part is located the metal used is of the wrong hardness.
考虑这个电子设备故障的例子。某组织收到客户关于设备定期短路的投诉，并与 NTS 签订合同以进行根本原因故障分析。电子故障分析测试显示组件短路，因为根据零件中金属的位置，所用金属的硬度不正确。
Step 3: Determining Corrective Actions
第 3 步：确定纠正措施
For most organizations, determining corrective actions is the most important part of a root cause failure analysis. When you use NTS for root cause failure analysis, you will receive a comprehensive report on both the causes and effects of device failure. NTS may also provide recommendations for correcting problems.
对于大多数组织来说，确定纠正措施是根本原因故障分析中最重要的部分。当您使用 NTS 进行根本原因故障分析时，您将收到有关设备故障原因和影响的综合报告。 NTS 还可以提供纠正问题的建议。
Many of the recommendations for correcting a problem are small changes that can have a significant impact. Small changes in how source materials and product components are tested, treated and stored can significantly reduce device failure.
许多纠正问题的建议都是微小的改变，但可能会产生重大影响。源材料和产品组件的测试、处理和存储方式的微小变化可以显着减少设备故障。
In other cases, we find that failure occurs when customers use a device for too long or in the wrong operating conditions. In these cases, our recommendations might include additional product education for marketing and sales staff. These employees can then provide this information to customers. This prevents device failures from improper use or application.
在其他情况下，我们发现当客户使用设备时间过长或在错误的操作条件下会发生故障。在这些情况下，我们的建议可能包括对营销和销售人员进行额外的产品教育。然后，这些员工可以向客户提供这些信息。这可以防止因使用或应用不当而导致设备故障。
We can also help you to determine whether corrective action is necessary. Some organizations may decide the economic costs of correcting rare product failure is unnecessary. If device failure is rare and has minimal consequences, replacing failed components may be more cost effective than changing the manufacturing process. Failure analysis testing can provide you with knowledge needed to make an informed decision.
我们还可以帮助您确定是否需要采取纠正措施。一些组织可能认为纠正罕见产品故障的经济成本是不必要的。如果设备故障很少见且后果极小，则更换故障组件可能比改变制造工艺更具成本效益。故障分析测试可以为您提供做出明智决策所需的知识。
ailure Analysis Tests 失效分析测试
Root cause failure analysis uses a variety of tests to determine the true source of a product failure. These tests are divided into two categories: non-destructive tests, which keep a product intact; and destructive tests, which require the product to be altered in order to examine cross-sections or thermal behavior.
根本原因故障分析使用各种测试来确定产品故障的真正根源。这些测试分为两类：无损测试，保持产品完好无损；以及破坏性测试，需要改变产品以检查横截面或热行为。
NTS begins its analysis with non-destructive analysis (NDA) as these tests are intended to prevent further damage to the product. Starting with NDA is generally more cost-effective. This is also the preferred method to preserve evidence of the failure mode.
NTS 从无损分析 (NDA) 开始分析，因为这些测试旨在防止产品进一步损坏。从 NDA 开始通常更具成本效益。这也是保存故障模式证据的首选方法。
| Visual Examination 目视检查 | Non-Destructive 非破坏性 |
| Optical Microscopy 光学显微镜 | Non-Destructive 非破坏性 |
| Scanning Acoustic Microscopy 扫描声学显微镜 | Non-Destructive 非破坏性 |
| 2D / 3D X-Ray Radiography 2D / 3D X 射线摄影 | Non-Destructive 非破坏性 |
| X-Ray Fluorescence Spectroscopy X射线荧光光谱法 | Non-Destructive 非破坏性 |
| Curve Trace / Electrical Inspection 曲线追踪/电气检查 | Non-Destructive 非破坏性 |
| Contamination Analysis 污染分析 | Non-Destructive 非破坏性 |
| Thermal Analysis 热分析 | Destructive 破坏性的 |
| Destructive Physical Analysis (DPA) 破坏性物理分析 (DPA) | Destructive 破坏性的 |
| Cross-section Analysis 截面分析 | Destructive 破坏性的 |
All of the NTS laboratories are equipped for a wide range of test capabilities and are Internationally Accredited for both non-destructive testing methods like X-rays and microscopy, and destructive tests like contamination analysis and thermal analysis.
所有 NTS 实验室都配备了广泛的测试能力，并在 X 射线和显微镜等非破坏性测试方法以及污染分析和热分析等破坏性测试方面获得了国际认可
Printed Circuit Board Failure Analysis
印刷电路板故障分析
Most electronics manufactured today rely on printed circuit boards (PCB). From children’s toys to advanced computers, PCB’s are critical for many electronics. However, many printed circuit boards fail during the manufacturing process.
当今制造的大多数电子产品都依赖于印刷电路板 (PCB)。从儿童玩具到先进计算机，PCB 对于许多电子产品都至关重要。然而，许多印刷电路板在制造过程中会出现故障。
NTS’s PCB failure analysis can help an organization determine why its circuit boards are failing and how to resolve the issue. Root cause failure testing for circuit boards is a holistic process that can help you find more answers than a simple spot check.
NTS 的 PCB 故障分析可以帮助组织确定电路板故障的原因以及解决问题的方法。电路板的根本原因故障测试是一个整体过程，可以帮助您找到比简单抽查更多的答案。
We work with a variety of different printed circuit boards. In the past, NTS has performed root cause failure examinations on single-sided, double-sided, multi-layer circuit boards, flex, and high frequency/PTFE boards including buries and blind via holes structures.
我们使用各种不同的印刷电路板。过去，NTS 对单面、双面、多层电路板、柔性板和高频/PTFE 板（包括埋孔和盲孔结构）进行了根本原因故障检查。
Some of the tests that we use during a PCB failure examination include:
我们在 PCB 故障检查期间使用的一些测试包括：
- Cross-section analysis 截面分析
- Solderability testing 可焊性测试
- PCB contamination testing
PCB污染测试 - X-ray Inspection X射线检测
NTS’s failure analysis goes beyond simply identifying the cause of the problem. We can help you find ways to improve the product and correct faults during the PCB manufacturing process.
NTS 的故障分析不仅仅是确定问题的原因。我们可以帮助您找到改进产品并纠正 PCB 制造过程中的故障的方法。
Electronic Component Failure Analysis
电子元件失效分析
Electronic components and hardware failure can occur during many phases of a product’s lifecycle. Along with problems during the product design and manufacturing stage, electronic components can fail because of issues with:
电子元件和硬件故障可能发生在产品生命周期的许多阶段。除了产品设计和制造阶段出现问题外，电子元件还可能因以下问题而发生故障：
- Storage 贮存
- Packaging 包装
- Installation 安装
- Operation 手术
- Maintenance 维护
We use both non-destructive and destructive tests to determine the root cause of electronic component failures. Our electronic components technicians work with a wide variety of tools and software to choose the right test techniques for your products.
我们使用无损和破坏性测试来确定电子元件故障的根本原因。我们的电子元件技术人员使用各种工具和软件来为您的产品选择正确的测试技术。
NTS failure analysis examinations of electronic components often use signal generators, sniffers and vector signal analyzers. We also use microscopy, X-ray, and contamination analysis where necessary. NTS testers can also test for hardware failure during installation and operation using a variety of languages and operating platforms.
NTS 电子元件故障分析检查经常使用信号发生器、嗅探器和矢量信号分析仪。必要时我们还会使用显微镜、X 射线和污染分析。 NTS测试仪还可以使用多种语言和操作平台测试安装和操作过程中的硬件故障。
Electronic Device Failure Analysis
电子设备故障分析
Determining the root cause of electronic device failure is often more difficult than determining root cause failure for other objects. Interactions between software and hardware, it’s important to find a laboratory that is skilled in electronic device failure analysis.
确定电子设备故障的根本原因通常比确定其他对象故障的根本原因更困难。软件和硬件之间的相互作用，找到一个擅长电子设备故障分析的实验室很重要。
NTS laboratories are equipped to diagnose both software and hardware problems that occur during electronic device failure. We consider ourselves tool agnostic. That means that we’ll select the tools and tests that are suitable for analyzing your specific device.
NTS 实验室具备诊断电子设备故障期间出现的软件和硬件问题的能力。我们认为自己与工具无关。这意味着我们将选择适合分析您的特定设备的工具和测试。
Our staff is experienced in developing electronic device tests in C/C++, Java and Python, among other languages. We also use a wide range of electrical device tools such as IBM Rational Robot, Borland Silk Test and National Instruments’ LabView. Our website on hardware and software testing has more information about NTS laboratories’ capacity in this area.
我们的员工在使用 C/C++、Java 和 Python 等语言开发电子设备测试方面拥有丰富的经验。我们还使用各种电气设备工具，例如 IBM Rational Robot、Borland Silk Test 和 National Instruments 的 LabView。我们的硬件和软件测试网站提供了有关 NTS 实验室在该领域能力的更多信息。
We go beyond simply meeting the standards for electronic hardware failure testing. NTS laboratories are sought out to help create the best practices for it. NTS has worked closely with several standards groups to develop failure analysis tools for electronic components
我们不仅仅满足电子硬件故障测试的标准。 NTS 实验室寻求帮助为其创建最佳实践。 NTS 与多个标准组织密切合作，开发电子元件故障分析工具
Metal Failure Analysis 金属失效分析
Metal failure can have a big impact on products across the supply chain. From contamination and corrosion that causes medical equipment to fail to stress failures that affect structural integrity, metal failure can have major consequences. It’s estimated metal corrosion alone accounts for nearly $300 billion in economic losses each year.
金属故障会对整个供应链的产品产生重大影响。从导致医疗设备失效的污染和腐蚀到影响结构完整性的应力故障，金属故障可能会产生重大后果。据估计，仅金属腐蚀每年就造成近 3000 亿美元的经济损失。
NTS’ root cause failure testing for metals can help your organization determine why metal components are failing and how to fix the issue. We provide metal testing for clients in a wide variety of industries, including:
NTS 的金属根本原因故障测试可以帮助您的组织确定金属部件发生故障的原因以及如何解决问题。我们为各行各业的客户提供金属测试，包括：
- Aerospace 航天
- Defense 防御
- Telecommunications 电信
- Consumer products 消费产品
Failure Analysis is a complex process that relies on a variety of techniques. Our state-of-the-art data acquisition tools help us determine the cause of metal failure quickly and help you determine solutions to fix the problem. We regularly perform corrosion studies, impact tests and fatigue testing on metal components. NTS can also create custom testing chambers and fixtures for failure testing of oversized metal components.
故障分析是一个复杂的过程，依赖于多种技术。我们最先进的数据采集工具帮助我们快速确定金属故障的原因，并帮助您确定解决问题的解决方案。我们定期对金属部件进行腐蚀研究、冲击测试和疲劳测试。 NTS 还可以创建定制测试室和夹具，用于超大金属部件的故障测试。
NTS is experienced in developing custom testing programs that comply with both national and international certification standards. NTS labs are ISO-17025 accredited for root cause failure testing of metal products.
NTS 在开发符合国家和国际认证标准的定制测试计划方面拥有丰富的经验。 NTS 实验室获得了 ISO-17025 金属产品根本原因故障测试认证。
Plastic / Composite Failure Analysis
塑料/复合材料失效分析
Plastics can fail in many different ways. Plastic products can fail from stress fractures, fatigue, material degradation and contamination. Plastic products can also fail in less-serious ways: discoloration and distortion can both affect the integrity of plastic products. Determining the exact cause of plastic failure requires a range of tests and a broad knowledge of polymers.
塑料可能会以多种不同的方式失效。塑料产品可能会因应力断裂、疲劳、材料降解和污染而失效。塑料产品也可能以不太严重的方式出现故障：变色和变形都会影响塑料产品的完整性。确定塑料失效的确切原因需要进行一系列测试和广泛的聚合物知识。
Root cause testing for plastic failures follows a similar process to that used for metal failure analysis. Plastic failure analysis can be more complex, because plastics often contain additives like plasticizers, colorants and reinforcing fillers. As a result, failure testing for plastic products often requires specialized testing of the molecular and chemical structures in plastics.
塑料失效的根本原因测试遵循与金属失效分析类似的过程。塑料失效分析可能更加复杂，因为塑料通常含有增塑剂、着色剂和增强填料等添加剂。因此，塑料产品的失效测试通常需要对塑料中的分子和化学结构进行专门测试。
NTS’ labs are equipped with state-of-the-art equipment for plastic failure analysis. We use non-destructive testing techniques like microscopy and spectroscopic analysis wherever possible.
NTS 的实验室配备了最先进的塑料失效分析设备。我们尽可能使用显微镜和光谱分析等无损检测技术。
NTS provides root cause failure analysis for plastic consumer goods as well as industrial components for the aerospace and defense industries. Whether the failure occurs in manufacturing or after production, we focus on identifying the cause of the failure quickly and developing a solution to prevent further product failures.
NTS 为塑料消费品以及航空航天和国防工业的工业部件提供根本原因故障分析。无论故障发生在制造过程中还是生产后，我们都专注于快速识别故障原因并制定解决方案以防止进一步的产品故障。
Contamination Analysis 污染分析
If there are contaminants in the supply chain, it is essential to control them quickly. However, identifying contaminants can be a time-consuming process that requires major resources.
如果供应链中存在污染物，则必须快速控制它们。然而，识别污染物可能是一个耗时的过程，需要大量资源。
NTS lab’s contamination analysis and identification can help you find contamination that leads to product failure. The process we use to identify contaminants depends on the product, the type of contamination and the client’s goals.
NTS实验室的污染分析和识别可以帮助您找到导致产品故障的污染。我们用于识别污染物的过程取决于产品、污染类型和客户的目标。
Types of contamination analysis we typically conduct include:
我们通常进行的污染分析类型包括：
- Identifying the type and source of foreign particles in a product
识别产品中异物的类型和来源 - Determining the level at which a contaminant affects product integrity
确定污染物影响产品完整性的程度 - Tracing the source of contamination and developing corrective plans
追踪污染源并制定纠正计划
As contamination is often a multi-faceted problem, we use a multi-disciplinary approach to our contamination analysis.
由于污染通常是一个多方面的问题，因此我们采用多学科方法进行污染分析。
NTS is an accredited failure analysis specialist. We hold ISO 17025 and A2LA accreditations specifically for Root Cause Failure Analysis. This means that our laboratories meet high standards for testing and calibration, and the tests we conduct are accepted by a wide variety of suppliers and regulatory authorities.
NTS 是经过认证的故障分析专家。我们拥有专门针对根本原因故障分析的 ISO 17025 和 A2LA 认证。这意味着我们的实验室符合测试和校准的高标准，并且我们进行的测试得到了众多供应商和监管机构的认可。