FEI DualBeam 835

FEI DualBeam 835 Technical Specifications

  • Accelerating voltage: 100-30 kV
  • Ion beam energy: 10-40 keV
  • Ion beam current: 1 pA-100 nA
  • Electron beam current: 0.1-10 pA
  • Resolution: 0.14 nm
  • Sensitivity: 10 e-/Å2
  • Stability: < 0.1 nm/h

FEI DualBeam 835 Main Applications

The FEI DualBeam 835 is a dual-beam microscope manufactured by FEI. It combines the functions of a scanning electron microscope (SEM) and a focused ion beam (FIB), making it a versatile tool for a wide range of materials science and industrial applications.

SEM Functions

The SEM functions of the FEI DualBeam 835 can be used for:

  • Surface morphology imaging
  • Composition analysis
  • Electrical property analysis
  • Mechanical property analysis

FIB Functions

The FIB functions of the FEI DualBeam 835 can be used for:

  • Sample preparation
  • Nanofabrication
  • Atomic probe tomography (APT)

Specific Applications

The FEI DualBeam 835 can be used for the following applications:

  • Basic research: crystal structure, material defects, surface and interfaces, etc.
  • Applied research: nanomaterials, semiconductors, biomedicine, etc.
  • Industrial applications: product analysis, failure diagnosis, quality control, etc.

Specific Application Examples

  • Crystal structure research: The FEI DualBeam 835 can be used to study the crystal structure of crystals, including lattice constant, lattice defects, and grain boundaries. For example, it can be used to study the crystal structure of metals, semiconductors, and ceramics.
  • Material defect research: The FEI DualBeam 835 can be used to study defects in materials, including grain boundaries, dislocations, and impurities. For example, it can be used to study grain boundary sliding in metal materials and defect states in semiconductor materials.
  • Surface and interface research: The FEI DualBeam 835 can be used to study the surfaces and interfaces of materials, including morphology, structure, and chemical composition. For example, it can be used to study surface corrosion of metal materials and interface contact of semiconductor materials.
  • Nanomaterial research: The FEI DualBeam 835 can be used to study the structure and properties of nanomaterials, including carbon nanotubes, graphene, and nanocrystals. For example, it can be used to study the structure and properties of carbon nanotubes, graphene, and nanocrystals.
  • Semiconductor research: The FEI DualBeam 835 can be used to study the structure, defects, and properties of semiconductor materials. For example, it can be used to study the manufacturing process of semiconductor devices and failure diagnosis.
  • Biomedical research: The FEI DualBeam 835 can be used to study the structure and function of biological samples. For example, it can be used to study the structure and function of cells, tissues, and organs.
  • Product analysis: The FEI DualBeam 835 can be used to analyze the structure and defects of products. For example, it can be used to analyze the weld joints of metal materials and defects in semiconductor devices.
  • Failure diagnosis: The FEI DualBeam 835 can be used to diagnose product failures. For example, it can be used to diagnose fractures in metal materials and damage to semiconductor devices.
  • Quality control: The FEI DualBeam 835 can be used to control the quality of products. For example, it can be used to control the surface quality of metal materials and the dimensions of semiconductor devices.

In conclusion, the FEI DualBeam 835 is a versatile dual-beam microscope that can be used for a wide range of materials science and industrial applications. It has high resolution, high sensitivity, and high stability, making it a valuable tool for scientists and engineers.


FEI DualBeam 835 技术参数

  • 加速电压:100-30 kV
  • 离子束能量:10-40 keV
  • 离子束流:1 pA-100 nA
  • 电子束流:0.1-10 pA
  • 分辨率:0.14 nm
  • 灵敏度:10 e-/Å2
  • 稳定性:< 0.1 nm/h

FEI DualBeam 835 主要用途

FEI DualBeam 835 是一台双束电镜,由 FEI 公司生产。它结合了扫描电子显微镜 (SEM) 和聚焦离子束 (FIB) 的功能,可用于多种材料的科学研究和工业应用。

SEM 功能

FEI DualBeam 835 的 SEM 功能可用于:

  • 表面形貌成像
  • 成分分析
  • 电学特性分析
  • 力学特性分析

FIB 功能

FEI DualBeam 835 的 FIB 功能可用于:

  • 样品制备
  • 纳米加工
  • 原子探针断层扫描 (APT)

具体应用

FEI DualBeam 835 可用于以下应用:

  • 基础研究:晶体结构、材料缺陷、表面和界面等
  • 应用研究:纳米材料、半导体、生物医学等
  • 工业应用:产品分析、故障诊断、质量控制等

具体应用示例

  • 晶体结构研究:FEI DualBeam 835 可用于研究晶体的晶体结构,包括晶格常数、晶格缺陷、晶界等。例如,它可用于研究金属、半导体、陶瓷等材料的晶体结构。
  • 材料缺陷研究:FEI DualBeam 835 可用于研究材料中的缺陷,包括晶界、位错、杂质等。例如,它可用于研究金属材料中的晶界滑移、半导体材料中的缺陷态等。
  • 表面和界面研究:FEI DualBeam 835 可用于研究材料的表面和界面,包括形貌、结构、化学组成等。例如,它可用于研究金属材料的表面腐蚀、半导体材料的界面接触等。
  • 纳米材料研究:FEI DualBeam 835 可用于研究纳米材料的结构、性能等。例如,它可用于研究碳纳米管、石墨烯、纳米晶体等材料。
  • 半导体研究:FEI DualBeam 835 可用于研究半导体材料的结构、缺陷、性能等。例如,它可用于研究半导体器件的制造工艺、故障诊断等。
  • 生物医学研究:FEI DualBeam 835 可用于研究生物样品的结构、功能等。例如,它可用于研究细胞、组织、器官等的结构和功能。
  • 产品分析:FEI DualBeam 835 可用于分析产品的结构、缺陷等。例如,它可用于分析金属材料的焊接接头、半导体器件的缺陷等。
  • 故障诊断:FEI DualBeam 835 可用于诊断产品的故障。例如,它可用于诊断金属材料的断裂、半导体器件的损坏等。
  • 质量控制:FEI DualBeam 835 可用于控制产品的质量。例如,它可用于控制金属材料的表面质量、半导体器件的尺寸等。

总而言之,FEI DualBeam 835 是一台功能强大的双束电镜,可用于多种材料的科学研究和工业应用。它具有高分辨率、高灵敏度、高稳定性等特点,可满足不同应用的需求。